Electronics & Semiconductors

Japan to pay up to $320M for US company's chip production

Japan is providing a major U.S. chipmaker a subsidy of up to 46.6 billion yen ($322 million) to support its plan to produce advanced memory chips at a Hiroshima factory, the Japanese trade minister said Friday.

Engineering

Objects can now be 3D-printed in opaque resin

A team of EPFL engineers has developed a 3D-printing method that uses light to make objects out of opaque resin in a matter of seconds. Their breakthrough could have promising applications in the biomedical industry, such ...

Electronics & Semiconductors

Kirigami cools electronics

Scientists from SANKEN (The Institute of Scientific and Industrial Research) at Osaka University, Oita National College of Technology, and Tokyo Polytechnic University demonstrated enhanced passive convective cooling using ...

Engineering

The virtual paper-making machine of the future

A virtual paper-making machine makes it possible to test run and optimize operations without costly downtime in the industry. New research at Karlstad University saves money and spares the environment.

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