Engineering

Blowing dust to cool fusion plasmas

Future tokamak fusion power reactors will generate heat beyond what current materials can withstand. Scientists have proposed various methods for cooling the edge of the magnetically confined fusion fuel, or plasma, to ...

Electronics & Semiconductors

Development of a diamond transistor with high hole mobility

Using a new fabrication technique, NIMS has developed a diamond field-effect transistor (FET) with high hole mobility, which allows reduced conduction loss and higher operational speed. This new FET also exhibits normally ...

Electronics & Semiconductors

A strategy to remotely modulate the doping of 2D transistors

When fabricating electronic devices based on conventional semiconducting materials, engineers need to complete a crucial step known as doping. Doping essentially entails the introduction of impurities into semiconductors ...

Electronics & Semiconductors

Heterogeneous epitaxy of semiconductors targeting the post-Moore era

A research team led by Prof. Liu Zhiqiang from the Institute of Semiconductors of the Chinese Academy of Sciences, in cooperation with the team led by Prof. Gao Peng from Peking University and the team led by Prof. Liu Zhongfan ...

Electronics & Semiconductors

Microchips of the future: Suitable insulators are still missing

For decades, there has been a trend in microelectronics towards ever smaller and more compact transistors. 2D materials such as graphene are seen as a beacon of hope here: they are the thinnest material layers that can possibly ...

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