Engineering
Scientists at Forschungszentrum Jülich have fabricated a new type of transistor from a germanium–tin alloy that has several advantages over conventional switching elements. Charge carriers can move faster in the material ...
Apr 27, 2023
2
694
Hardware
Everyone is talking about the newest AI and the power of neural networks, forgetting that software is limited by the hardware on which it runs. But it is hardware, says USC Professor of Electrical and Computer Engineering ...
Mar 29, 2023
0
416
Engineering
Researchers at the Professorship of Electrical Energy Conversion Systems and Drives at Chemnitz University of Technology have succeeded for the first time in 3D printing housings for power electronic components that are used, ...
Jul 6, 2022
0
137
Electronics & Semiconductors
Taiwan's GlobalWafers on Monday unveiled plans to establish a massive plant in northern Texas to produce a component vital to making semiconductors with an investment of up to $5 billion.
Jun 27, 2022
0
32
Computer Sciences
The year is 2030 and we are at the world's largest tech conference, CES in Las Vegas. A crowd is gathered to watch a big tech company unveil its new smartphone. The CEO comes to the stage and announces the Nyooro, containing ...
May 25, 2022
0
27
Electronics & Semiconductors
Scientists from the Nanyang Technological University, Singapore (NTU Singapore) and the Korea Institute of Machinery & Materials (KIMM) have developed a technique to create a highly uniform and scalable semiconductor wafer, ...
Mar 16, 2022
0
6
Business
A proposed takeover of German chip supplier Siltronic by Taiwan's GlobalWafers has fallen through after the German government failed to give its approval by a Monday night deadline.
Feb 1, 2022
0
33
Electronics & Semiconductors
A pioneering type of patented computer memory known as ULTRARAM has been demonstrated on silicon wafers in what is a major step towards its large-scale manufacture.
Jan 7, 2022
0
110
Hardware
Researchers at The Rockefeller University have shed new light on Moore's Law—perhaps the world's most famous technological prediction—that chip density, or the number of components on an integrated circuit, would double ...
Aug 18, 2021
1
583
Engineering
A collaboration between EPFL and UCSB has developed a long-anticipated breakthrough, and demonstrated CMOS technology—used for building microprocessors and memory chips—that allows wafer-scale manufacturing of chip-scale ...
Jul 1, 2021
0
3
