Business
American Airlines said Wednesday that customers with PreCheck can go through security checkpoints at Dallas-Fort Worth International Airport with a face scan and phone app instead of showing their driver's license or passport.
Jun 22, 2022
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Energy & Green Tech
As our tech needs grow and the Internet of Things increasingly connects our devices and sensors together, figuring out how to provide power in remote locations has become an expanding field of research.
Jun 22, 2022
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Consumer & Gadgets
You've got a smartphone. Maybe a smartwatch. Or even a smart doorbell.
Jun 22, 2022
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Hi Tech & Innovation
Biometric authentication like fingerprint and iris scans are a staple of any spy movie, and trying to circumvent those security measures is often a core plot point. But these days the technology is not limited to spies, as ...
Jun 22, 2022
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Energy & Green Tech
As interest grows in the potential of using "green" hydrogen generated from renewable electricity to help decarbonize maritime shipping, a new study from the International Council on Clean Transportation (ICCT) estimates ...
Jun 22, 2022
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Consumer & Gadgets
Is the Better Business Bureau still relevant to consumers in an age of almost instant response on social media platforms like Twitter and Instagram?
Jun 22, 2022
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Automotive
A pair of Rutgers engineers have developed a tool aided by artificial intelligence to detect trespassing on railroad crossings and curb fatalities that have been increasing over the past decade.
Jun 22, 2022
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Electronics & Semiconductors
The invention of the transistor in 1947 by Shockley, Bardeen and Brattain at Bell Laboratories ushered in the age of microelectronics and revolutionized our lives. First, so-called bipolar transistors were invented, in which ...
Jun 22, 2022
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Engineering
A Colorado company is channeling the industriousness of microorganisms to grow zero-carbon cement in a process that is similar to the way corals build reefs or oysters produce shells.
Jun 22, 2022
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Electronics & Semiconductors
Scientists from the Flexible 3D-System Integration Laboratory at Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver, which can reduce the cost and energy requirements ...
Jun 22, 2022
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