Semiconductor device fabrication encompasses the materials, processes, and integration schemes used to build electronic and optoelectronic components on the wafer scale. Work in this area spans growth and patterning of 2D and ultrawide-bandgap semiconductors, advanced CMOS and power transistor architectures, and integration of organic, oxide, and nitride materials. It also includes thermoelectric and ferroelectric thin films, metrology for transport and thermal properties, defect and vacancy engineering, and additive or transfer-based manufacturing routes for flexible, high-density, and cryogenic-compatible microchips and displays.
Engineering
A research team affiliated with UNIST has made a significant breakthrough in overcoming one of the most persistent challenges hindering the commercialization of two-dimensional (2D) semiconductor materials—contact resistance.
Dec 1, 2025
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Electronics & Semiconductors
Japanese chipmaker Rapidus plans to start building a second factory to produce cutting-edge semiconductors in a race with Taiwanese industry leader TSMC, local media reports said.
Nov 26, 2025
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Energy & Green Tech
Scientists have developed a new material that converts motion into electricity (piezoelectricity) with greater efficiency and without using toxic lead—paving the way for a new generation of devices that we use in everyday ...
Nov 25, 2025
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Engineering
A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, performance and efficiency. Two-dimensional (2D) semiconductors, single-layer and thin materials with a controllable ...
Electronics & Semiconductors
By studying the theoretical limits of how light can be used to perform computation, Cornell researchers have uncovered new insights and strategies for designing energy-efficient optical computing systems.
Nov 20, 2025
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Electronics & Semiconductors
The average global temperature has risen by 1.5 C since the pre-industrial era due to climate change, and it is poised to continue increasing. In response, the Intergovernmental Panel on Climate Change has developed the Global ...
Nov 18, 2025
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Electronics & Semiconductors
The optical properties of a thin layer of the semiconductor germanium-tin (GeSn) sandwiched between barriers of silicon-germanium-tin (SiGeSn), a structure known as a quantum well, have been studied with a focus on improving ...
Nov 18, 2025
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Electronics & Semiconductors
A research team led by Prof. Hu Weijin from the Institute of Metal Research (IMR) of the Chinese Academy of Sciences (CAS), in collaboration with partners, has developed a one-second fabrication method for wafer-scale energy ...
Nov 18, 2025
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Engineering
A research team led by Prof. Zou Xudong from the Aerospace Information Research Institute of the Chinese Academy of Sciences (AIRCAS) has proposed a new solution to address two longstanding challenges in Micro-Electro-Mechanical ...
Nov 17, 2025
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Engineering
A research team affiliated with UNIST has uncovered a critical flaw in the performance evaluation metrics that have long guided researchers in semiconductor development. This discovery raises concerns that the commonly used ...
Nov 12, 2025
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