Page 3: Research news on Semiconductor device fabrication

Semiconductor device fabrication encompasses the materials, processes, and integration schemes used to build electronic and optoelectronic components on the wafer scale. Work in this area spans growth and patterning of 2D and ultrawide-bandgap semiconductors, advanced CMOS and power transistor architectures, and integration of organic, oxide, and nitride materials. It also includes thermoelectric and ferroelectric thin films, metrology for transport and thermal properties, defect and vacancy engineering, and additive or transfer-based manufacturing routes for flexible, high-density, and cryogenic-compatible microchips and displays.

Electronics & Semiconductors

Photonic chip packaging can withstand extreme environments

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic integrated circuits—tiny chips that convey information using light instead of electricity—so they can survive ...

Electronics & Semiconductors

Expanding storage capacity with smart gate semiconductor technology

From smartphones to large-scale AI servers, most digital information in modern society is stored in NAND flash memory. KAIST researchers have developed an innovative technology that can overcome the limitations of next-generation ...

Electronics & Semiconductors

Lead-free thin films turn everyday vibrations into electricity

Powerful electronics don't have to come at an environmental cost. Scientists at Osaka Metropolitan University have developed high-performance, lead-free piezoelectric thin films directly on standard silicon wafers. Their ...

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