Page 33: Research news on Semiconductor device fabrication

Semiconductor device fabrication encompasses the materials, processes, and integration schemes used to build electronic and optoelectronic components on the wafer scale. Work in this area spans growth and patterning of 2D and ultrawide-bandgap semiconductors, advanced CMOS and power transistor architectures, and integration of organic, oxide, and nitride materials. It also includes thermoelectric and ferroelectric thin films, metrology for transport and thermal properties, defect and vacancy engineering, and additive or transfer-based manufacturing routes for flexible, high-density, and cryogenic-compatible microchips and displays.

Hardware

New chip tests cooling solutions for stacked microelectronics

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow high-performance processors, ...

Electronics & Semiconductors

New electronic 'skin' could enable lightweight night-vision glasses

MIT engineers have developed a technique to grow and peel ultrathin "skins" of electronic material. The method could pave the way for new classes of electronic devices, such as ultrathin wearable sensors, flexible transistors ...

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