Electronics & Semiconductors
Metal halide perovskites (MHPs) are a class of materials with promising properties for semiconductor applications, such as thin-film transistors (TFTs). In particular, tin (Sn)-based MHPs could be an environmentally benign ...
Feb 7, 2022
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100
Energy & Green Tech
All-solid-state batteries are now one step closer to becoming the powerhouse of next-generation electronics, as researchers from Tokyo Tech, National Institute of Advanced Industrial Science and Technology (AIST), and Yamagata ...
Jan 7, 2022
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373
Energy & Green Tech
One of the barriers to generating electricity from wind and solar energy is their intermittent nature. A promising alternative to accommodate the fluctuations in power output during unfavorable environmental conditions are ...
Dec 20, 2021
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297
Electronics & Semiconductors
The trade-off between carrier mobility and stability in amorphous oxide semiconductor-based thin film transistors (TFTs) has been finally overcome by researchers from Tokyo Institute of Technology (Tokyo Tech) in an ingeniously ...
Dec 16, 2021
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Engineering
An international business–academia collaboration has yielded a new type of projector that can project RGB and invisible infrared images simultaneously and independently at a high speed of almost 1,000 fps. With its high ...
Dec 2, 2021
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19
Telecom
Wireless technology enables radio and satellite communication. Central to these systems are antennas that can transmit and receive signals. As the scope of wireless technology continues to grow, the next generation of wireless ...
Sep 27, 2021
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3
Electronics & Semiconductors
Convolutional neural networks (CNNs) have enabled numerous AI-enhanced applications, such as image recognition. However, the implementation of state-of-the-art CNNs on low-power edge devices of Internet-of-Things (IoT) networks ...
Aug 23, 2021
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254
Internet
Scientists at Tokyo Institute of Technology (Tokyo Tech) and NEC Corporation have jointly developed a 28-GHz phased-array transceiver that supports efficient and reliable 5G communications. The proposed transceiver outperforms ...
Jun 11, 2021
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4
Electronics & Semiconductors
Scientists at Tokyo Institute of Technology develop a 3D functional interposer—the interface between a chip and the package substrate—containing an embedded capacitor. This compact design saves a lot of package area and ...
Jun 1, 2021
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3
Computer Sciences
In the modern day, our interactions with voice-based devices and services continue to increase. In this light, researchers at Tokyo Institute of Technology and RIKEN, Japan, have performed a meta-synthesis to understand how ...
Jun 1, 2021
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