Engineering

Temperature-resistant power semiconductors from a 3D printer

Researchers at the Professorship of Electrical Energy Conversion Systems and Drives at Chemnitz University of Technology have succeeded for the first time in 3D printing housings for power electronic components that are used, ...

Electronics & Semiconductors

GlobalWafers announces plans for massive US plant

Taiwan's GlobalWafers on Monday unveiled plans to establish a massive plant in northern Texas to produce a component vital to making semiconductors with an investment of up to $5 billion.

Hardware

Reappraisal of Moore's law through chip density

Researchers at The Rockefeller University have shed new light on Moore's Law—perhaps the world's most famous technological prediction—that chip density, or the number of components on an integrated circuit, would double ...

Engineering

Scalable manufacturing of integrated optical frequency combs

A collaboration between EPFL and UCSB has developed a long-anticipated breakthrough, and demonstrated CMOS technology—used for building microprocessors and memory chips—that allows wafer-scale manufacturing of chip-scale ...

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