Hardware

A novel chip-on-wafer platform for next-generation AI hardware

A new semiconductor integration platform developed at the Institute of Science Tokyo combines advanced chip packaging with high-density interconnects and improved thermal management. This combination of three complementary ...

Energy & Green Tech

Why AI may boost carbon emissions instead of cutting them

AI data centers get a bad rap, not least because of concerns that they drive climate change by consuming massive amounts of electricity. But one potentially larger impact of AI on global carbon emissions may be that it's ...

Engineering

New model bridges ferroelectric physics and circuit modeling

A new physics-based analytical model can accurately predict ferroelectric behavior under real-world, complex voltages, according to a study led by University of Michigan Engineering. The model bridges the longstanding gap ...

page 1 from 2