Engineering

New model bridges ferroelectric physics and circuit modeling

A new physics-based analytical model can accurately predict ferroelectric behavior under real-world, complex voltages, according to a study led by University of Michigan Engineering. The model bridges the longstanding gap ...

Hardware

A novel chip-on-wafer platform for next-generation AI hardware

A new semiconductor integration platform developed at the Institute of Science Tokyo combines advanced chip packaging with high-density interconnects and improved thermal management. This combination of three complementary ...

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