Business

AI can help make complex IPO filings easier to analyze

For investors trying to make sense of a company going public, one of the most important documents is often the most difficult to understand. Initial public offering (IPO) filings are dense disclosures submitted to the U.S. ...

Engineering

New model bridges ferroelectric physics and circuit modeling

A new physics-based analytical model can accurately predict ferroelectric behavior under real-world, complex voltages, according to a study led by University of Michigan Engineering. The model bridges the longstanding gap ...

Hardware

A novel chip-on-wafer platform for next-generation AI hardware

A new semiconductor integration platform developed at the Institute of Science Tokyo combines advanced chip packaging with high-density interconnects and improved thermal management. This combination of three complementary ...

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