Engineering

Scientists announce breakthrough in hypersonic heat shield

In a giant leap for future hypersonic flight, Chinese scientists have turned to multi-scale technology to develop a revolutionary new material that has achieved record high marks in tests for vital strength and thermal insulation ...

Electronics & Semiconductors

Microchips of the future: Suitable insulators are still missing

For decades, there has been a trend in microelectronics towards ever smaller and more compact transistors. 2D materials such as graphene are seen as a beacon of hope here: they are the thinnest material layers that can possibly ...

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