Engineering

Scientists announce breakthrough in hypersonic heat shield

In a giant leap for future hypersonic flight, Chinese scientists have turned to multi-scale technology to develop a revolutionary new material that has achieved record high marks in tests for vital strength and thermal insulation ...

Electronics & Semiconductors

New material design for transistors could downsize next-gen tech

By better taming the Jekyll-and-Hyde nature of an alternative to the semiconductor—one that transitions from electricity-resisting insulator to current-conducting metal—Nebraska's Xia Hong and colleagues may have unlocked ...

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