Hardware

A novel chip-on-wafer platform for next-generation AI hardware

A new semiconductor integration platform developed at the Institute of Science Tokyo combines advanced chip packaging with high-density interconnects and improved thermal management. This combination of three complementary ...

Computer Sciences

Hidden goals can undermine AI teamwork, study finds

Large language models (LLMs), the computational models that underpin conversational agents such as Gemini and ChatGPT, are now widely used by people worldwide to rapidly find information, summarize documents and generate ...

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